Hi guys,
Have some pictures of the AUAV-X1 board with connectors - top side and bottom side. Also some scopes applied - input voltage from 4V to 8VDC and different loads - 0.5A and 1A.
Some picture explanations - from top to bottom:
TPS63061_4V_1A
TPS63061_5V_0.5A
TPS63061_7V_1A
TPS63061_8V_0.5A
The temperatures are respectively - 34.5 deg C of the TPS63061, 31 deg C of the Schottky diode, 28 deg C of the inductor. They remain stable within an hour measurements. The output voltage is perfect stable - 5.05VDC. The LDO output voltages are between 3.305 and 3.312VDC respectively.
Best regards
Nick
Comments
Hi Nick,
You can add weight block
Aaron
Hi Aaron,
I've been thinking a lot over the flexi board idea and I think it has some cons as follow:
When locating the sensors over the flexible board, you are lowering the total mass of the sensor group, thus making it vulnerable toward the higher vibration frequencies. Lower the mass, higher the resonant frequency.
Maybe better is to have some bigger mass attached under the sensor group, then this combination placed on a silicone rubber damper. Also the width of the trace zone between the main board and the sensor plate should be as narrow as possible, to be as flexible as possible, thus reducing the conducted vibrations from the main board.
It seems it is not so easy to isolate the sensor group from vibrations at all. I still have no conclusion which one is better ( light weight mass vs heavy mass ). More, the ST set and MPU6000 have a bit different mechanical resonant frequencies - ST is about 20kHz, while the MPU6000 has a MRF 27-33kHz depending on axis.
All proposals and advices are highly appreciated!
Nick
Hi Nick,
Yes, your idea is correct. Cooling issues remain to be resolved.
Best regards
Aaron
So, we don't need the microIMU boards at all....the IMU ICs will be soldered directly over the larger zone of the flexible board.
Btw, the blue zone ( Chips ) should not be there. From STM32F4 up, the order is: heatsink, anti shock material, flexible board, IMU ICs. The problem is that the anti shock material will hinter the heatsink from dissipating the heat.
Yes, your idea is feasible. Heat sink and damping plate imaging can do the same sandwich structure.。
Best regards
Aaron
+ some addons to your idea:
As STM32F4xx is the main heat dissipation device, if we can find out how to combine a small heatsink with an anti shock plate, we could achieve the perfect solution.
More, having much larger flexible board, we can combine the ST set with either MPU6000 or the newer one MPU9250.
Hi Nick,
Yes, your understanding is correct. flexible board can be soldered directly to the motherboard.
Best regards
Aaron
Hi Aaron,
This is great idea. It could solve all our problems with the dimensions of the IMU.
As I understand your idea, the flexible board will have a connector at one side and all the IMU ICs soldered on the larger non vibrating surface? That's really cool!....and feasible. The only thing which has to be solved is the design of the transition between the mainboard and the flexible board.
Best regards
Nick
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